Ceramic Dual-In-line Package (CERDIP), CERPACK and Flatpack are ceramic-based packages.

CERDIP, like the PDIP is a through-hole package with peripheral leads on two parallel sides of the package. In lieu of the plastic molding compound, which encapsulates the device in a PDIP package, ceramic base and caps hold the silicon chip, which is wire bonded to the post of the leadframe. The leadframe is a separate material, which is attached to the base. The sealing process hermetically seals the wire-bonded device. 

We have the capability to assemble CERDIP packages from 8 leads up to 40 leads.

In a CERPACK, the leads have been directly attached to the ceramic base material and therefore do not require the extra leadframe attach process.

Flatpack is similar to the CERPACK. The only difference between these packages is that the leads, which have been directly attached to the ceramic base material, are flat, instead of in a through-hole form. Flatpack is surface mount package.