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Other Packages
CLCC

Ceramic Leadless Chip Carrier (CLCC), as the name suggests, is a leadless ceramic-based surface-mount package. Unlike its leaded ceramic package counterparts (CERDIP, CERPACK and Flatpack), CLCC has the metalized terminals directly designed in the ceramic package. Hermetic sealing of the ceramic package is a part of the assembly process.  

CLCC’s are used in high reliability applications such as in military and communication.

Package Type & 
Lead Count

CLCC
( 3 & 20 Leads)

Materials 

Base and Cap

Die Attach

Wirebond

Ceramic (Customer-consigned materials)

Eutectic

Aluminum Wire

Product Applications

Amplifier, Diode Array

End Market

Military, Industrial

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