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Power Packages
Powerflex™ |
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PSi's Powerflex™ offers the customer a surface-mountable power package. This package boasts of three distinguishing features - thin, surface-mountable and thermally enhanced.
Powerflex™ is available in 2, 3, 5 and 7 pin versions and each one has its own technical attributes. This package has a low profile to help reduce the total system size while retaining most of the power dissipation characteristics. This package is often used in medium power applications. -Powerflex™ is a trademark of Texas Instruments.
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Package Type &
Lead Count |
Powerflex™
( 2 / 3 / 5 / 7 Leads) |
Dimensions
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Package Dimension
Die Pad Dimension
Maximum Die Size
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238 x 242 x 75 mils ( 2 Leads)
370 x 355 x 75 mils (3, 5, & 7 Leads)
140 x 130 mils (2 Leads)
190 x 190 mils (3,5 & 7 Leads)
116 x 110 mils (2 Leads)
170 x 166 mils (3,5 & 7Leads) |
Materials |
Lead Frame
Die Attach
Wirebond
Mold Compound |
PMC90
Epoxy
Gold Wire
KTMC5400G (Green)
CEL824HF10G
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Thermal Resistance |
Junction-to-Ambient |
30 - 70 ºC/W* |
Electrical Performance |
Voltage Rating
Current Rating |
36 Volts*
5 Amperes* |
Product Applications |
Diodes (Small Signal Diodes, Zener Diodes)
Small Signal & Switching Transistors (Bipolar Small Signal Transistors, Field Effect Transistors)
Power Transistors (Bipolar General Purpose Power Transistors, Field Effect General Purpose Power Transistors, Insulated Gate Bipolar Transistors)
Rectifiers (Power Diodes)
Thyristors
Standard Linear Analog (Amplifiers, Voltage Regulators & References)
MOS Logic (MOS General Purpose Logic) |
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* Customer Product Data
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Copyright © 2005 • PSi Technologies, Inc. • All Rights Reserved.
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