Powermite is a patented packaging architecture in ultra small, low profile and low thermal resistance packages. Powermite's unique features are:

• Built-in heatsink - The patented "full-metal-bottom" design provides the optimal heat path or dissipating junction heat.
• Wrap-Around Construction - The patented interlocking construction incorporates a path for solder to "wick" up the side of the package and enhance power dissipation.

It also incorporates a completely non-magnetic material design and no wire bonds resulting in significantly lower high frequency losses and dramatically higher surge ratings than wire-bonded SMT packages. 

Powermite 1 devices are 1/3 the size of comparably rated products such as SMA. Powermite 3 package offers improved power dissipation capabilities against the SMC package, and almost comparable performance versus the DPAK package.

Powermite 1 and Powermite 3 packages are useful for the following product applications: PDA's and handheld computers, wireless web tablets, mobile phones and radios, pagers and wireless messaging and heat sensitive optical power supplies.

- Powermite is a patented packaging technology developed by Microsemi Corporation.