Power Packages

Power semiconductors can be found in a vast array of everyday products. We believe we offer our customers the broadest line power semiconductor packages in the industry. Our packages offer a wide range of standard and advanced thermal and electrical characteristics to accommodate varying semiconductor applications. We focus our package development on producing incremental improvements to customer designs and providing packages that are both more durable and more cost effective for our customers.

Our power packages are mostly leaded packages, but recently we developed one of the industry’s very first leadless power packages - PowerQFN. Leaded packages for power semiconductors are characterized by a semiconductor chip encapsulated in a special, non-conducting plastic mold compound with metal leads protruding from one or more edges of the package. The metal leads are designed to be attached to a printed circuit board, thereby integrating the semiconductor device into the ultimate end product. We offer leaded packages that use traditional pin-through-hole technology as well as more advanced surface mount technology. Our pin-through-hole packages are designed to be plugged into printed circuit boards by inserting the leads through holes on the board and are generally used for applications with high power requirements and minimal space restrictions. Our surface mount technology packages, which include leaded and leadless types, are designed to be soldered to the printed circuit boards and are generally used for applications with tighter space restrictions.

Nearly all of our power semiconductor packages can accommodate more than one power semiconductor product application. Power semiconductor can serve a number of product applications, including input rectification, control, switching and output rectification. Input rectification generally refers to conditioning alternating current, AC, to direct current, DC. The control function measures incoming electricity and sends a signal to a switch. A switch divides the current into discrete units. Finally, output rectification reconfigures the power into a form usable by the electronic component.

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