Products-Power QFN

More Product Info

Power Packages Product Chart

Power Packages

Power Packages
PowerQFN

QFN (Quad Flat No-Leads) is a leadless package with peripheral terminal pads and exposed die pad for enhanced thermal performance.

PSi's PowerQFN technology combines some of the best performance advantages of chip-scale packaging and multi-chip modules resulting in improved power-handling and thermal advantages over its discrete counterparts. It offers:

Lower thermal resistance
Lower inductance
Lower capacitance

The smaller and thinner package brings the added benefit of product miniaturization. It is capable of MSL 1, 260 ºC

PSi's PowerQFN utilizes a unique solder die attach process in combination with clip attach, aluminum or gold wire bond interconnects.

Our PowerQFN package sizes will range from 2x2 mm up to 12x12 mm. We have the capability to match every customer's desired footprints, within the array of QFN package dimensions.

PowerQFN could be used in a variety of applications. Applications requiring improved thermal performance, reduced size or weight and low standoff height will significantly benefit from these packages. Some of these applications are cell phones, PDA's, portable music and video players.

Package Type

Power QFN

Power QFN
3 x 3 mm Dimensions

Package Dimension

Die Pad Dimension

Maximum Die Size

18.1 x 118.1 x 39.4 mils

99.2 x 82.7 mils

82.3 x 66.7 mils

Power QFN
3.3 x 3.3 mm Dimensions

Package Dimension

Die Pad Dimension

Maximum Die Size

129.9 x 129.9 x 39.4mils

114.2 x 86.6 mils

98.2 x 70.6 mils

Power QFN
5 x 6 mm Dimension

Package Dimension

Die Pad Dimension

Maximum Die Size

196.9 x 236.2 x 34.9 mils

177.9 x 131.1 mils

161.9 x 115.1 mils

Materials

Lead Frame

Die Attach

Clip Frame (Option)

Wirebond (Option)

Molding Compound

Lead Finish

C194

Solder Paste
88Pb/10Sn/02Ag, 95Pb/5Sn

C194

Al/Gold/Al ribbon

"Green" material

100% Sn

Package Characteristics
3 x 3 mm

Power Dissipation

Thermal Resistance
Junction-to-Ambient

Electrical Performance
Voltage Rating
Current Rating

0.7 Watt

120 ºC/W

320 Volts
0.15 Ampere

Package Characteristics
3. x3 x 3.3 mm

Power Dissipation

Thermal Resistance
Junction-to-Ambient
Junction-to-Case

Electrical Performance
Voltage Rating
Current Rating

69 Watts

45 ºC/W
2 ºC/W

40 Volts
40 Amperes

Package Characteristics
5 x 6

Power Dissipation
Thermal Resistance
Junction-to-Ambient
Junction-to-Case

Electrical Performance
   Voltage Rating
   Current Rating
      VGS = 10V, Tc =25ºC
Parasitic Resistance
Parasitic Inductance
Parasitic RDSon

7 Watts

40 ºC/W
1 ºC/W

25 Volts
25 Amperes

0.12 mΩ
0.59 nH
2.29 mΩ

Product Applications

Diodes (Small Signal Diodes, Zener Diodes)
Small Signal and Switching Transistors (Bipolar Small Signal Junction Transistors, Field Effect Transistors)
Thyristors, Standard Linear Analog (Amplifiers, Voltage Regulators and References)
MOS Logic

Note: Values indicated in the PowerQFN packages electrical and thermal characteristics are from customers' product data.