Package Type |
Power QFN 3.3 x 3.3 mm
|
Dimensions
|
Package Dimension
Die Pad Dimension
Maximum Die Size |
129.9 x 129.9 x 39.4mils
114.2 x 86.6 mils
98.2 x 70.6 mils |
Materials |
Lead Frame
Die Attach
Clip Frame (Option)
Wirebond (Option)
Molding Compound
Lead Finish |
C194
Solder Paste
88Pb/10Sn/02Ag, 95Pb/5Sn
C194
Al/Gold/Al ribbon
"Green" material
100% Sn |
|
Power Dissipation
Thermal Resistance
Junction-to-Ambient
Junction-to-Case
Electrical Performance
Voltage Rating
Current Rating |
69 Watts
45 ºC/W
2 ºC/W
40 Volts
40 Amperes
|
Product Applications |
Diodes (Small Signal Diodes, Zener Diodes)
Small Signal and Switching Transistors (Bipolar Small Signal Junction Transistors, Field Effect Transistors)
Thyristors, Standard Linear Analog (Amplifiers, Voltage Regulators and References)
MOS Logic |
