Package Type |
Power QFN 5 x 6 mm
|
Dimensions
|
Package Dimension
Die Pad Dimension
Maximum Die Size |
196.9 x 236.2 x 34.9 mils
177.9 x 131.1 mils
161.9 x 115.1 mils |
Materials |
Lead Frame
Die Attach
Clip Frame (Option)
Wirebond (Option)
Molding Compound
Lead Finish |
C194
Solder Paste
88Pb/10Sn/02Ag, 95Pb/5Sn
C194
Al/Gold/Al ribbon
"Green" material
100% Sn |
|
Power Dissipation
Thermal Resistance
Junction-to-Ambient
Junction-to-Case
Electrical Performance
Voltage Rating
Current Rating
VGS = 10V, Tc =25ºC
Parasitic Resistance
Parasitic Inductance
Parasitic RDSon |
7 Watts
40 ºC/W
1 ºC/W
25 Volts
25 Amperes
0.12 mΩ
0.59 nH
2.29 mΩ |
Product Applications |
Diodes (Small Signal Diodes, Zener Diodes)
Small Signal and Switching Transistors (Bipolar Small Signal Junction Transistors, Field Effect Transistors)
Thyristors, Standard Linear Analog (Amplifiers, Voltage Regulators and References)
MOS Logic |
