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Power Packages
SOT-223 |
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This is a small signal transistor package designed for surface mount applications. The formed leads absorb thermal stress during soldering, thereby eliminating the possibility of damage to the die. The encapsulation material used in this package enhances the device reliability, which allows it to exhibit excellent performance in high temperature and humidity environment.
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Package Type &
Lead Count
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SOT-223
(3 Leads)
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Dimensions
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Package Dimension
Die Pad Dimension
Maximum Die Size |
256 x 138 x 63 mils
104 x 100 mils
94 x 94 mils
80 x 74 mils for Soft Solder |
Materials |
Lead Frame
Die Attach
Wirebond
Mold Compound
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A194 Epoxy / Soft Solder
Gold Wire
EME6710S
MP8000MH
KTMC5400G |
Power Dissipation |
1 – 1.5 Watts* |
Thermal Resistance |
Junction-to-Ambient
Junction-to-Case |
50 – 545 ºC/W *
15 ºC/W * |
Electrical Performance |
Voltage Rating
Current Rating |
37 Volts *
1.2 Amperes * |
Product Applications |
Small Signal & Switching Transistors (Bipolar Small Signal Transistor, Field Effects Transistors)
Power Transistors (Bipolar General Purpose Power Transistors, Field Effect General Purpose Power Transistors, Insulated Gate Bipolar Transistors)
Thyristors
Standard Linear Analog (Amplifiers, Voltage Regulators & References)
MOS Logic (MOS General Purpose Logic)
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| * Customer Product Data |
Copyright © 2005 • PSi Technologies, Inc. • All Rights Reserved.
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