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Power Packages
SOT-23 |
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SOT-23 is a small surface mount package ideal for devices where reduced size and weight are important. It is particularly suited to applications such as in portable and hand-held equipment – mobile phones, handheld computers, wireless messaging, PDA's and others.
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Package Type &
Lead Count
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SOT-23
(3 Leads)
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Dimensions
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Package Dimension
Die Pad Dimension
Maximum Die Size |
114 x 51 x 38 mils
43 x 35 mils
33 x 29 mils |
Materials |
Lead Frame
Die Attach
Wirebond
Mold Compound |
A194
Eutectic
Gold Wire
MP74F |
Power Dissipation |
0.2 – 0.35 Watt* |
Thermal Resistance |
Junction-to-Ambient
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210 - 500 ºC/W* |
Electrical Performance |
Voltage Rating
Current Rating
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100 Volts*
0.6 Ampere* |
Product Applications |
Diodes (Small Signal Diodes, Zener Diodes)
Small Signal & Switching Transistors (Bipolar Small Signal Transistor, Field Effect Transistors)
Thyristors
Standard Linear Analog (Amplifiers, Voltage Regulators & References) MOS Logic (MOS General Purpose Logic)
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| * Customer Product Data |
Copyright © 2005 • PSi Technologies, Inc. • All Rights Reserved.
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