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Power Packages
SOT-82 |
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This package is in between DPAK (TO-252) and TO-220 in package size but is comparable to the large form factor package like TO 220 in performance. Leadframes for the SOT-82 package come either in full nickel or selective silver plating, allowing wire bonding using aluminum or gold wire.
The SOT-82 package is often used in over-voltage protection device in telecommunications equipment. It can also be used to hold high power controlled rectifiers, DC-to-AC converters or frequency converters. These types of devices are ideal for home appliance applications. |
Package Type &
Lead Count
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SOT-82
( 3 Leads)
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Dimensions
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Package Dimension
Die Pad Dimension
Maximum Die Size |
421 x 299 x 103 mils
180 x 303 mils
156 x 283 mils |
Materials |
Lead Frame
Die Attach
Wirebond
Mold Compound
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PMC90
Soft Solder
Aluminum Wire, Gold Wire
KTMC1030NAP
MP150SG
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Power Dissipation |
42 Watts* |
Thermal Resistance |
Junction-to-Ambient
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95 - 100 ºC/W*
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Electrical Performance |
Voltage Rating
Current Rating |
800 Volts*
10 Amperes* |
Product Applications |
Diodes (Small Signal Diodes, Zener Diodes)
Small Signal & Switching Transistors (Bipolar Small Signal Transistor, Field Effect Transistors)
Power Transistors (Bipolar General Purpose Power Transistors, Field Effect General Purpose Power Transistors, Insulated Gate Bipolar Transistors)
Rectifiers (Power Diodes)
Thyristors
Standard Linear Analog (Amplifiers, Voltage Regulators & References)
MOS Logic (MOS General Purpose Logic)
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| * Customer Product Data |
Copyright © 2005 • PSi Technologies, Inc. • All Rights Reserved.
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