Products-TO 218 / SOT 93

More Product Info

Power Packages Product Chart

Power Packages

Power Packages
TO-218 / SOT-93

SOT-93 is a through-hole mount package between TO-220 and TO-247 in terms of package size. This package is designed to cater to aluminum wire bonding, the standard process technology for high current application devices. This package is capable of carrying high gain and low drive current devices that are extensively used in analog power amplifiers and logic driven power switches.

Package Type &
Lead Count

TO-218 / SOT-93
( 3Leads)

Dimensions

Package Dimension

Die Pad Dimension

Maximum Die Size

588 x 480 x 189 mils

453 x 272 mils

429 x 252 mils

Materials

Lead Frame

Die Attach

Wirebond

Mold Compound

PMC90

Soft Solder

Aluminum Wire

MG15F-0140R

Power Dissipation

47 - 125 Watts*

Thermal Resistance

Junction-to-Ambient

Junction to Case

35.7- 40 ºC/W*

0.45 - 1.5 ºC/W*

Electrical Performance

Voltage Rating

Current Rating

600 Volts*

70 Amperes*

Product Applications

Power Transistors (Bipolar General Purpose Power Transistors, Field Effect General Purpose Power Transistors, Insulated Gate Bipolar Transistors)
Rectifiers (Power Diodes)
Thyristors

* Customer Product Data