Products-TO 220 Fullpack

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TO-220 Fullpack (Isolated TO-220)

The TO-220 Fullpack package is ideal in providing electrical isolation since the heatsink is fully encapsulated with molding compound. The package offers high performance and compact design.

This package has the same footprint as a standard TO-220 but with an encapsulated heatsink. For users who do not want to employ the use of the surface mount package but need to improve the manufacturability of their system, this is the package to use. No extra hardware is needed to provide electrical isolation between the device and the heatsink since this is fully encapsulated. Thus, this makes it easier to use and assemble relative to a standard TO-220.

The TO-220 Fullpack package provides isolation of up to 5KV and is ideal for various motor drive applications and power supplies.

Package Type & Lead Count	TO-220 Fullpack (2 and 3Leads)
Dimensions 2 / 3 Leads	Package Dimension Die Pad Dimension Maximum Die Size	413 x 603 x 185 mils 276 x 248 mils 2 x 153 x 266 mils (Dual Pad) 252 x 228 mils 129 x 246 mils x 2 pads
Dimensions 2 Leads (Real)	Package Dimension Die Pad Dimension Maximum Die Size	413 x 603 x 185 mils 276 x 248 mils 252 x 228 mils
Materials	Lead Frame Die Attach Wirebond Mold Compound	PMC90 / KFC Soft Solder Aluminum Wire KMC125 KTM3097S KTMC3097G (Green)
Power Dissipation	30 – 60 Watts*
Thermal Resistance	Junction-to-Ambient Junction-to-Case	55- 80 ºC/W* 2.4 – 4.3 ºC/W*
Electrical Performance	Voltage Rating Current Rating	1000 Volts* 76 Amperes*
Product Applications	Diodes (Small Signal Diodes, Zener Diodes) Small Signal & Switching Transistors (Bipolar Small Signal Transistors, Field Effect Transistors) Power Transistors (Bipolar General Purpose Power Transistors, Field Effect General Purpose Power Transistors, Insulated Gate Bipolar Transistors) Rectifiers (Power Diodes) Thyristors Standard Linear Analog (Amplifiers, Voltage Regulators & References) MOS Logic (MOS General Purpose Logic)

* Customer Product Data