|
|
 |
| |
 |
Power Packages
TO-247 |
|
TO-247 is a large form factor through-hole package. Due to its excellent power dissipation characteristic, this package is ideal for Power MOSFET's, High Power Bipolar Transistors and IGBT's.
PSi has the capability for dual die, dual solder dispense process for this package using fully automated soft solder Die Bonder system.
|
Package Type &
Lead Count
|
TO-247
( 2 and 3Leads)
|
Dimensions
|
Package Dimension
Die Pad Dimension
Maximum Die Size
|
626 x 825 x 198 mils
479 x 322 mils
455 x 302 mils |
Materials |
Lead Frame
Die Attach
Wirebond
Mold Compound |
TAMAC4
Soft Solder
Aluminum Wire
MP195
KTMC5400G (Green)
|
Power Dissipation |
175 - 310 Watts* |
Thermal Resistance |
Junction-to-Ambient
Junction to Case |
40- 60 ºC/W*
0.4 -1.5 ºC/W* |
Electrical Performance |
Voltage Rating
Current Rating |
1200 Volts*
75 Amperes* |
Product Applications |
Power Transistors (Bipolar General Purpose Power Transistors, Field Effect General Purpose Power Transistors, Insulated Gate Bipolar Transistors)
Rectifiers (Power Diodes)
Thyristors
|
|
|
| * Customer Product Data |
Copyright © 2005 • PSi Technologies, Inc. • All Rights Reserved.
|
|
|
