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Power Packages
TO-247

TO-247 is a large form factor through-hole package. Due to its excellent power dissipation characteristic, this package is ideal for Power MOSFET's, High Power Bipolar Transistors and IGBT's.

PSi has the capability for dual die, dual solder dispense process for this package using fully automated soft solder Die Bonder system.    

Package Type & 
Lead Count

TO-247
( 2 and 3Leads)

Dimensions

Package Dimension

Die Pad Dimension

Maximum Die Size

626 x 825 x 198 mils

479 x 322 mils

455 x 302 mils
Materials 

Lead Frame

Die Attach

Wirebond

Mold Compound

TAMAC4

Soft Solder

Aluminum Wire

MP195
KTMC5400G (Green)

Power Dissipation
175 - 310 Watts*
Thermal Resistance

Junction-to-Ambient

Junction to Case

40- 60 ºC/W*

0.4 -1.5 ºC/W*

Electrical Performance

Voltage Rating

Current Rating

1200 Volts*

75 Amperes*

Product Applications

Power Transistors (Bipolar General Purpose Power Transistors, Field Effect General Purpose Power Transistors, Insulated Gate Bipolar Transistors)
Rectifiers (Power Diodes)
Thyristors

* Customer Product Data

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