Package Type &
Lead Count
|
TO-251 / TO-252
(2 and 5 Leads)
|
Dimensions
TO-251 ( 3 Leads )
|
Package Dimension
Die Pad Dimension
Maximum Die Size
|
260 x 240 x 90 mils
158 x 116 mils ( option 1 & 2)
190 x 140 mils ( option 3 & 4)
134 x 96 mils
166 x 122 mils |
Dimensions
TO-252 ( 2 / 3 Leads )
|
Package Dimension
Die Pad Dimension
Maximum Die Size
|
260 x 240 x 90 mils
158 x 116 mils (option 1 &2)
190 x 140 mils (option 3 & 4)
134 x 96 mils
166 x 122 mils
|
Dimensions
TO-252 ( 4 / 5 Leads )
|
Package Dimension
Die Pad Dimension
Maximum Die Size
|
260 x 240 x 90 mils
158 x 116 mils
134 x 96 mils |
Materials |
Lead Frame
Die Attach
Wirebond
Mold Compound
|
KFC, HCL12S
Epoxy, Soft Solder
Aluminum Wire, Gold Wire
EME6300H
MP195
KTMC5400G (Green)
KTMC1030NA Red
CK6000HV
|
Power Dissipation |
20 - 100 Watts*
|
Thermal Resistance |
Junction-to-Ambient
Junction-to-Case |
50 to 100 ºC/W* 1.5 – 8.0 ºC/W*
|
Electrical Performance |
Voltage Rating
Current Rating |
800 Volts*
50 Amperes* |
Product Applications |
Diodes (Small Signal Diodes, Zener Diodes)
Small Signal & Switching Transistors
(Bipolar Small Signal Transistors, Field Effect Transistors)
Power Transistors (Bipolar General Purpose Power Transistors, Field Effect General Purpose Power Transistors, Insulated Gate Bipolar Transistors)
Rectifiers (Power Diodes)
Thyristors
Standard Linear Analog (Amplifiers, Voltage Regulators & References)
MOS Logic (MOS General Purpose Logic)
|
