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Power Packages
TO-263 |
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TO-263, the surface-mount package version of the TO-220 package, comes in 2, 3, and 5 leads options.
One of the advantages of our TO-263 package is its capability to accommodate large dice, owing to its large pad design. This package is ideal for high power applications due to its low resistance. Typical applications for this package are in home appliances and personal computers.
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Package Type &
Lead Count
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TO-263
(2 / 3 / 5 Leads)
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Dimensions
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Package Dimension
Die Pad Dimension
Maximum Die Size |
400 x 340 x 175 mils
226 x 170 mils
202 x 150 mils |
Materials |
Lead Frame
Die Attach
Wirebond
Mold Compound
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TAMAC2, PMC90
Epoxy, Soft Solder
Aluminum, Gold Wire
MG15F-0140
CK6000HV
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Power Dissipation |
38 - 230 Watts* |
Thermal Resistance |
Junction-to-Ambient
Junction-to-Case |
50 - 80 ºC/W*
0.8 - 3.3 ºC/W* |
Electrical Performance |
Voltage Rating
Current Rating |
600 Volts*
80 Amperes* |
Product Applications |
Diodes (Small Signal Diodes, Zener Diodes)
Small Signal & Switching Transistors (Bipolar Small Signal Transistors, Field Effect Transistors)
Power Transistors (Bipolar General Purpose Power Transistors, Field Effect General Purpose Power Transistors, Insulated Gate Bipolar Transistors)
Rectifiers (Power Diodes)
Thyristors
Standard Linear Analog (Amplifiers, Voltage Regulators & References)
MOS Logic (MOS General Purpose Logic)
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| * Customer Product Data |
Copyright © 2005 • PSi Technologies, Inc. • All Rights Reserved.
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