Products-TO 264

More Product Info

Power Packages Product Chart

Advanced Technology Standard Power Packages

Power Packages

Power Packages
TO-264

TO-264 is the biggest among our large form factor packages This package is designed to withstand the high voltage and high speed switching applications that come with most of the power devices. Our TO-264 is able to accommodate dual/multiple die technology and “system-in-package” type assembly. This is normally used in power supplies, converters and PWM control.

Package Type & Lead Count	TO-264 ( 3 / 5 Leads)
Dimensions	Package Dimension Die Pad Dimension Maximum Die Size	783 x 1023 x 199 mils 577 x 427 mils 553 x 407 mils
Materials	Lead Frame Die Attach Wirebond Mold Compound	TAMAC4 Soft Solder Aluminum Wire MG15F-0140R
Power Dissipation	200 - 520 Watts*
Thermal Resistance	Junction-to-Ambient Junction-to-Case	40 ºC/W* 0.25 - 7.0 ºC/W*
Electrical Performance	Voltage Rating Current Rating	800 Volts* 100 Amperes*
Product Applications	Power Transistors (Bipolar General Purpose Power Transistors, Field Effect General Purpose Power Transistors, Insulated Gate Bipolar Transistors) Rectifiers (Power Diodes) Thyristors

* Customer Product Data