Package Type &
Lead Count
|
TO-92 / DO-92
(2 and 3 Leads)
|
DO-92 ( 2 Leads )
Dimensions
|
Package Dimension
Die Pad Dimension
Maximum Die Size
|
180 x 180 x 140 mils
140 x 100 mils (side collector)
130 x 94 mils
116 x 80 mils for Soft Solder |
TO-92 ( 3 Leads )
Dimensions
|
Package Dimension
Die Pad Dimension
Maximum Die Size |
180 x 180 x 140 mils
140 x 100 mils (side collector)
130 x 94 mils
116 x 80 mils for Soft Solder |
Package Dimension
Die Pad Dimension
Maximum Die Size |
180 x 180 x 140 mils
85 x 112 mils (side collector)
75 x 106 mils
61 x 96 mils for Soft Solder |
Package Dimension
Die Pad Dimension
Maximum Die Size |
180 x 180 x 140 mils
105 x 100 mils (center collector)
95 x 94 mils
81x 80 mils for Soft Solder |
| Package Dimension
Die Pad Dimension
Maximum Die Size |
180 x 180 x 140 mils
118 x 100 mils (center collector)
108 x 94 mils
94 x 80 mils for Soft Solder |
Materials |
Lead Frame
Die Attach
Wirebond
Mold Compound |
A194
Epoxy
Soft Solder
Eutectic
Gold Wire
Starcom ST7100GXM
KTMC5400G (Green)
|
Power Dissipation |
0.1 – 0.9 Watt* |
Thermal Resistance |
Junction-to-Ambient
Junction-to-Case |
80 - 310 ºC/W*
150 ºC/W* |
Electrical Performance |
Voltage Rating
Current Rating |
800 Volts*
6 Amperes* |
Product Applications |
D
Diodes (Small Signal Diodes, Zener Diodes)
Small Signal & Switching Transistors (Bipolar Small Signal Transistor, Field Effect Transistors)
Thyristors
Standard Linear Analog (Amplifiers, Voltage Regulators & References)
MOS Logic (MOS General Purpose Logic)
|
