Package Type &
Lead Count
|
TO-220 / DO-220
(2 / 3 / 5 / 7 Leads)
|
Dimensions
2 Leads
|
Package Dimension
Die Pad Dimension
Maximum Die Size |
395 x 360 x 175 mils
269 x 201 mils
242 x 181 mils |
Dimensions
2 / 3 Leads
|
Package Dimension
Die Pad Dimension
Maximum Die Size |
400 x 340 x 175 mils
226 x 150 mils
202 x 150 mils |
Dimensions
3 Leads
|
Package Dimension
Die Pad Dimension
Maximum Die Size |
400 x 340 x 175 mils
320 x 200 mils
296 x 180 mils |
Dimensions
5 / 7 Leads
|
Package Dimension
Die Pad Dimension
Maximum Die Size |
400 x 329 x 175 mils
260 x 180 mils
236 x 160 mils |
Materials |
Lead Frame
Die Attach Wirebond
Mold Compound
|
PMC90
TAMAC2
Epoxy, Soft Solder
Aluminum, Gold Wire
MP150F-0140R
MP95F
MP195
KTMC5400G
KTMC1030NA Blue
CK6000HV
|
Power Dissipation |
50 – 130 Watts* |
Thermal Resistance |
Junction-to-Ambient
Junction-to-Case |
50 – 80 ºC/W*
1.0 – 7.8 ºC/W* |
Electrical Performance |
Voltage Rating
Current Rating |
1000 Volts*
64 Amperes* |
Product Applications |
Diodes (Small Signal Diodes, Zener Diodes)
Small Signal & Switching Transistors (Bipolar Small Signal Transistors, Field Effect Transistors)
Power Transistors (Bipolar General Purpose Power Transistors, Field Effect General Purpose Power Transistors, Insulated Gate Bipolar Transistors)
Rectifiers (Power Diodes)
Thyristors
Standard Linear Analog (Amplifiers, Voltage Regulators & References)
MOS Logic (MOS General Purpose Logic)
|
