Research and Development Services
We focus our research and development efforts on developing packages and assembly and test services sought by our existing customers in order to service a greater variety of their power semiconductor production, as well as those packages and services required to attract new customers. In addition to the development of new products, we also focus on continuously maintaining and improving our high standards of production through extensive quality efforts.
The latest product that came out of our research and development is the QFN (Quad Flat No-Leads), a leadless package with peripheral terminal pads and exposed die pad for enhanced thermal performance. Our PowerQFN utilizes a unique solder die attach process in combination with clip attach, aluminum or gold wire bond interconnects. The clip attach process offers lower package parasitic resistance, parasitic inductance, and Rds(on) versus the gold wire bonded package version.
One example of our innovation is on the dual-gauge DPAK (TO 252), a traditional power conversion package that we have made more robust and reliable through three generations of improvements.
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